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Tamjid Chowdhury

Research Areas

Electrochemistry, role of additives and nanostructure of copper/carbon nanotube composites for the damascene electroplating (3D interconnect) and synthesis of 1D nanostructure by template deposition technique. 

 

Education:

1. University College Cork (UCC), Ireland.

PhD student in Materials Chemistry (Jan 2007-Present)

Intel funded project: Electrodeposited Copper Composites for Advanced IC Interconnect

Supervisor: Dr. James Rohan, Research activity leader, Electrochemical Deposition and Micropower, Tyndall National Institute, Ireland.

2. University of Limerick (UL), Ireland.

M.Sc. (by Research) in Materials Physics (Jan 2004-June 2006)

Dissertation: Stress Evolution in Electrodeposited Copper Metallization during Deposition and Room-Temperature Aging

Supervisor: Prof. D. N. Buckley (President of Electrochemical Society), Chair of Physics, Department of Physics, University of Limerick, Ireland.

3. Bangladesh University of Engineering and Technology (BUET), Bangladesh.

M.Sc. Engineering in Materials and Metallurgical Engineering (April 2002- Jan 2004), First Class.

Thesis: Effect of Compositions and Firing Cycle on the Properties of High Tension Ceramic Insulator

Supervisor: Prof. Fakhrul Islam, Department of Materials and Metallurgical Engineering, BUET.

4. Bangladesh University of Engineering and Technology (BUET), Bangladesh.

B.Sc. Engineering in Metallurgical Engineering (Dec 1996- April 2002), First Class, position 5th.

 Current position

Jan 2007 - Present: Embark Initiative Intel Scholar, Microelectronics Applications Integration Group (MAI), Tyndall National Institute, Ireland.

Previous Positions

 Research Assistant, MSSI, University of Limerick: Oct,2006 - Dec,2006.

Researcher, National Materials Research Institute (MTEC), Thailand. Aug-Oct 2003.

Teaching Assistant, MME Department, BUET, Bangladesh July,2002-July 2003.

Summery of the project

 

The introduction of Cu metallization below 22 nm technology min next generation integrated circuits is involving a revolutionary change in process architecture for multilevel interconnects. The conversion from Cu to Carbon nanotube interconnects has introduced many new processes and materials into semiconductor manufacturing. Electrodeposited copper films for silicon chip interconnections are typically deposited at room temperature by an energetically gentle process and may be considered metastable immediately after deposition. The grain size and texture of copper film are known to be critical factors in determining the electromigration resistance as well as others properties of copper interconnects. The instability and failure of copper interconnect is due to grain growth, which is an important factor for further minimization of chip size, The issue of electromigration control of electroplated copper films by carbon nanotube has been a focus of interest now a days. In this project copper is codeposited with carbon nanotube.

Representative Publications


T. Chowdhury, D. P. Casey, J. F. Rohan, ‘Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates.’ accepted in Electrochemistry Communication, 2009.(Article in Press).

M. Hasan, T. Chowdhury, J. F. Rohan, ‘Cu2O Nanotubes as High Performance Anode Materials for Li-ion Rechargeable Batteries’, ECS Transactions Nanostructured Materials for Energy Storage and Conversion, will be submitted soon.

M. Hasan, T. Chowdhury, D. P. Casey, J. F. Rohan, ‘Electrochemical properties of Cu deposition from methanesulfonate electrolytes for ULSI and MEMS applications’, ECS Transactions Electrochemical Processing in ULSI and MEMS 4, will be submitted soon.

T. Chowdhury, S. Ahmed, D. N. Buckley, M.T. Laugier, S. Nakahara and C. Heffernan, ‘Stress Evolution in Electrodeposited Copper Metallization during Room- Temperature Aging’, ECS Transactions Copper Interconnects, New Contact and Barrier Metallurgies/Structures, and Low-k Inter-level Dielectrics III, 1(11), 93, 2006.

Conference Presentations.

T. Chowdhury and J. F. Rohan, ‘Influences of carbon nanotubes on the electrodeposition of copper interconnect’ submitted in E5 - Processing, Materials and Integration of Damascene and 3D Interconnects, 216th ECS Meeting - Vienna, Austria, 2009.

M. Hasan, T. Chowdhury, J. F. Rohan, ‘Cu2O Nanotubes as High Performance Anode Materials for Li-ion Rechargeable Batteries’, abstract no: 429, accepted for oral presentation in B7 - Nanostructured Materials for Energy Storage and Conversion, 215th ECS Meeting - San Francisco, CA, May, 2009.

M. Hasan, T. Chowdhury, D. P. Casey, J. F. Rohan, ‘Electrochemical properties of Cu deposition from methanesulfonate electrolytes for ULSI and MEMS applications’, abstract no: 980.accepted for oral presentation in F1 - Electrochemical Processing in ULSI and MEMS 4, 215th ECS Meeting - San Francisco, CA, May, 2009.

T. Chowdhury and J. F. Rohan, ‘Templated Cu/CNT nanoscale composite electrodeposition.’ presented in 5th Intel Ireland Research Conference, Sept, 2008.

T. Chowdhury, A. Panupat, F. Islam, ’Effect of Firing Schedule on the properties of High Tension Ceramic Insulator,’ 31st Cocoa Beach Conference & Exposition on Advanced Ceramics and Composites, Florida, Jan, 2007.

T. Chowdhury, S. Ahmed, M.T. Laugier, S. Nakahara, D.N Buckley, ‘Stress Evolution in Electrodeposited Copper Metallization during Room- Temperature Aging’, 208th Electrochemical Society meeting (ECS), Los Angeles, CA, Oct, 2005.

A. Panupat, T. Chowdhury, N. Vaneesorn, A. Thanaboonsombutt, Md. Fakhrul Islam, ‘Influence of firing conditions on the microstructure of high tension ceramic insulators’, 13th European Microscopy Congress (EMC), August, 2004.

T. Chowdhury, A. Panupat, F. Islam, ‘Study on local clay for high tension ceramic insulator’, 2nd International Conference on structure, processing & properties of materials (SPPM), February, 2004.

T. Chowdhury, R. Chowdhury, F. Islam, ‘Purification of local clay to make it suitable for ceramic insulator’, The 2nd International Conference on Thermal Engineering (BSME), Bangladesh, January, 2004.

T. Chowdhury, M. T. Chowdhury, F. Islam, ‘Development of Refining Techniques to Remove Free Silica and Mobile Ion in Local Clays Making it Suitable for Ceramic Insulators.’ 2nd International Conference on Materials for Advanced Technology (ICMAT), Singapore, December, 2003.

Proceedings

T. Chowdhury, F. Islam and A. Panupat, ‘Study on local clay for high tension ceramic insulator’, Proc. of the 2nd International Conference on structure, processing & properties of materials (SPPM), 534, 2004.

T. Chowdhury and E. Haque, ‘Study on ceramic water filter’, Proc. of IEB Conference, Bangladesh, 2003.

Poster presentations

T. Chowdhury and J. F. Rohan, ‘Cu/CNTs Composite for Advanced IC Interconnect.’, poster presented in Tyndall Postgraduate Poster Competition, 9th May, 2008.

T. Chowdhury and J. F. Rohan, ‘Cu/CNTs composite electrodeposition’, poster presented in 4th Intel Ireland Research Conference, Sept, 2007.

Honours / Awards

Embark Initiative Intel Postgraduate Scholarship, Jan 2007-Present.

Awarded Student Membership of Electrochemical Society (ECS) and Materials Research Society (MRS).

Travel Grant to attend 208th ECS conference, LA, 2005.

Postgraduate Scholarship, Jan 2004-Sept 2006, Science Foundation of Ireland (SFI), Ireland.

Research Grant Aug 2003-Oct 2003, MTEC National Science and Technology Development Agency.

BUET Academic Scholarship, 1998-1999.

Equipment Expertise / Training

Jan 2007 - Present: Tyndall National Institute, Cork, Ireland.

Experience on electrochemical measurement techniques: CH660B potentiostat (for cyclic voltammetry, chromoamperometeory, rotating disk electrode, microelectrode, and kinetic analysis)

Experience on the electrodeposition of 1-D nanomaterials by template synthesis technique

Electrical characterization of thin film by four point probe technique

Structural characterization of nanomaterials using FIB, SEM and XRD

Electrodeposition (plating line) of Cu, Ni, Sn.

Working on optical lithography, pattern wafer and developing technique

Oct 2006 - Dec 2006: Materials & Surface Science Institute, Limerick, Ireland.

Trained on high temperature x-ray diffraction (Philips X’pert PRO MPD) and thermal analysis (DTA)

Jan 2004 - Sept 2006:  Advanced Metallization Group, University of Limerick, Ireland.

Experience on thin film deposition technique: Edwards E306 A Coating System

Experience and develop difference types of stress measurement tools: lased based in situ stress setup with NIST collaboration, optical fiber stress system, FSM-8800 and Dektak surface profilometry

Trained on nanoindentation (CSMTM nanohardness tester)

Aug 2003 - Oct 2003:  National Metal and Materials Technology Center (MTEC), Thailand.

Experience on optical ceramography & scanning electron microscopy with energy dispersive x-ray

Trained on x-ray florescence (XRF), vicker hardness tester, bending tester and impedence analyzer

June 2001 - July 2001: Bangladesh Insulator and Sanitation Factory (BISF), Bangladesh.

Experience on high temperature ceramic furnace, tunnel kiln, bending strength tester, dielectric tester and particle size analyzer


Recent Article

Carbon Nanotube

Presentation

 Cu/CNT composite for microelectronic & communication devices


Upcoming Conference

213th ECS meeting, Vienna, Austria

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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